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description the moonstone tm 1w power led light source is a high performance energy ecient device which can handle high thermal and high driving current. the exposed pad design has excellent heat transfer from the package to the motherboard. the cool white power led is available in various color temperature ranging from 4000k to 10000k and warm white power led ranging from 2600k to 4000k. the low prole package design is suitable for a wide variety of applications especially where height is a constraint. the package is compatible with reow soldering process. this will give more freedom and exibility to the light source designer. applications portable (ash light, bicycle head light) reading light architectural lighting garden lighting decorative lighting asmt-mx00 moonstone tm 1 w power led light source data sheet features available in red, amber, green, blue, cool white and warm white color energy ecient exposed pad for excellent heat transfer suitable for reow soldering process high current operation long operation life wide viewing angle silicone encapsulation esd class hbm class 3b (threshold > 8 kv) msl 2a for ingan products msl 4 for alingap products specications allngap technology for red and amber 2.1v (typ) at 350ma for allngap ingan technology for green, blue, cool white and warm white 3.2v (typ) at 350ma for ingan
2 package dimensions device selection guide ( t j = 25c) part number color luminous flux, v [1,2] (lm) test current (ma) dice technology min. typ. max. asmt-mr00-agh00 red 25.5 35.0 43.0 350 alingap asmt-mr00-ahj00 33.0 40.0 56.0 350 alingap asmt-ma00-agh00 amber 25.5 35.0 43.0 350 alingap asmt-mg00 green 43.0 60.0 73.0 350 ingan asmt-mb00 blue 11.5 15.0 25.5 350 ingan asmt-mw00 cool white 43.0 60.0 73.0 350 ingan asmt-my00 warm white 43.0 50.0 73.0 350 ingan asmt-mwb1 cool white diused 43.0 55.0 73.0 350 ingan asmt-myb1 warm white diused 43.0 46.0 73.0 350 ingan notes 1. v is the total luminous ux output as measured with an integrating sphere at 25 ms mono pulse condition. 2. flux tolerance is 10%. metal slug cathode anode 1 2 3 10.00 8.50 3 1 2 8.50 ? 5.26 ? 8.00 5.08 0.81 2.00 5.25 1.30 10.60 1.27 3.30 heat sink led zener + ? notes: 1. all dimensions are in millimeters. 2. tolerance is 0.1 mm unless otherwise specied. 3. metal slug is connected to anode for electrically non-isolated option.
3 part numbering system note: 1. please refer to page 8 for selection details. asmt-m x xx C x x 1 x 2 x 3 x 4 packaging option color r C red a C amber g - green b - blue w - cool white y - warm white color bin selection maximum flux bin selection minimum flux bin selection dice type n C ingan a C allngap silicone type 00 C non-di?used b1 C di?used absolute maximum ratings (t a = 25c) parameter asmt-mx00/ asmt-mxb1 units dc forward current [1] 350 ma peak pulsing current [2] 1000 ma power dissipation for allngap 805 mw power dissipation for ingan 1225 mw led junction temperature for allngap 125 c led junction temperature for ingan 110 c operating ambient tempera ture range -40 to +100 c storage temperature range -40 to +120 c reverse volttage [3] not recommended notes: 1. dc forward current C derate linearly based on figure 5 for alingap & figure 11 for ingan. 2. pulse condition duty factor = 10%, frequency = 1khz. 3. not recommended for reverse bias operation.
4 optical characteristics at 350 ma (tj = 25c) part number color peak wavelength, peak (nm) dominant wave- length, d [1] (nm) viewing angle, 2? [2] () luminous eciency (lm/w) typ typ typ typ asmt-mr00-agh00 red 635 625 120 48 asmt-mr00-ahj00 red 635 625 120 54 asmt-ma00-agh00 amber 598 590 120 48 asmt-mg00 green 519 525 120 54 asmt-mb00 blue 460 467 120 13 part number color correlated color temperature, cct (kelvin) viewing angle, 2? [2] () luminous eciency (lm/w) min. max. typ typ asmt-mw00 cool white 4000 10000 110 54 asmt-my00 warm white 2600 4000 110 45 asmt-mwb1 cool white diused 4000 10000 110 49 asmt-myb1 warm white diused 2600 4000 110 41 electrical characteristic at 350 ma (t j = 25c) dice type forward voltage v f (volts) at i f = 350ma thermal resistance r j-ms ( c/w) [1] min. typ. max. typ. allngap 1.7 2.1 2.3 12 ingan 2.8 3.2 3.5 10 notes: 1. r j-ms is thermal resistance from led junction to metal slug.
5 figure 1. relative intensity vs. wavelength for alingap f igure 2. forward current vs forward voltage for alingap figure 3. relative luminous flux vs. mono pulse current for alingap figure 4. radiation pattern for alingap figure 5. maximum forward current vs. ambient temperature for alingap derated based on t j max = 125c, r ja = 40c/w / 50c/w and 60c/w figure 6. relative lop (normalized at 25c) vs. junction temperature for alingap jun c ti o n te mp erature - c relative l op (n orma l i z e d a t 25 c ) 0 0.5 1 1.5 2 -40 -25 -10 5 20 35 50 65 80 95 110 125 re d a mb er 0 50 100 150 200 250 300 350 400 0 102030405060708090 t a - a mb ient te mp erature - c i f - m ax f o rwar d c urrent - m a r ja = 60 c /w r ja = 40 c /w = 50 c /w r ja 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 50 100 150 200 250 300 350 400 450 500 mo n o p ul s e c urrent - m a relative lu m in o u s flux (- v) - l m 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -70 -50 -30 -10 10 30 50 70 90 o ff-axi s angle() relative inten s ity 0.0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 .0 380 430 480 530 580 630 680 730 780 waveleng th - n m rela ti ve i n t ens it y red amber 0 50 1 00 1 50 200 250 300 350 400 450 500 00.5 11 .5 2 2.5 3 f orward vol t age - v f orward curren t - ma
6 figure 7. relative intensity vs. wavelength for ingan figure 8. forward current vs. forward voltage for ingan figure 9. relative luminous flux vs mono pulse curr ent for ingan figure 10. radiation pattern for ingan figure 11. maximum forward current vs. ambient temperature for ingan derated based on t j max = 110c, r ja = 30c/w, 40c/w and 50c/w figure 12. dominant wavelength vs. forward current C ingan devices dom i nan t waveleng th C n m 1 00 450 f orward curren t C ma 400 5 1 0 520 200 1 50 540 530 250 300 490 350 480 470 460 500 green blue i f C max i mum f orward curren t C ma 0 0 t a C amb i en t t empera t ure C c 90 300 350 20 1 030 400 40 50 60 200 70 80 1 50 1 00 50 250 r ja = 50 c/w r ja = 40 c/w r ja = 30 c/w 0.0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 .0 380 430 480 530 580 630 680 730 780 waveleng th - n m rela ti ve i n t ens it y green blue cool w hit e warm w hit e 0.0 0.2 0.4 0.6 0.8 1 .0 1 .2 1 .4 050 1 00 1 50 200 250 300 350 400 450 500 mono pulse curren t - ma rela ti ve lum i nous f lux ( v) - l m 0.0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 .0 - 90 - 70 - 50 - 30 -1 0 1 030507090 o ff- ax i s angle () rela ti ve i n t ens it y green blue cool w hit e warm w hit e 0 50 1 00 1 50 200 250 300 350 400 450 500 00.5 11 .5 2 2.5 3 3.5 4 f orward vol t age - v f orward curren t - ma
7 figure 13. chromaticity shift vs. current *note: (x,y) values @ 350 ma reference to (0.0) figure 14. recommended reow soldering prole figure 15. recommended soldering land pattern figure 16. temperature vs. relative forward voltage shift f igure 17. relative lop vs junction temperature for ingan devices note: for detail information on reow soldering of avago surface mount leds, do refer to avago application note an1060 surface mounti ng smt led indicator components. 217 c 200 c 150 c 60 - 120 s e c . -6 c / s e c . m ax. 3 c / s e c . m ax. 3 c / s e c . m ax. 255 - 260 c 100 s e c . m ax. 10 - 30 s e c . ti m e te mp erature (a cc . t o j- s t d -020 c ) 17.00 0.20 1.00 0.10 3.1 0.10 8.40 0.10 5.08 0.10 10.70 0.10 y- coo r d inate s 0 0.002 0 x- coo r d inate s 0.008 0.014 0.003 0.002 0.001 0.016 0.004 0.005 0.006 0.01 0.007 0.008 0.006 0.004 0.012 100 m a 150 m a 250 m a 300 m a 350 m a -300 -250 -200 -150 -100 -50 0 50 100 150 200 250 300 -40 -15 10 35 60 85 te mp erature - c relative f o rwar d v o ltage s hift ( m v) 0 10 20 30 40 50 60 70 80 90 100 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100105110 jun c ti o n te mp erature ( c ) relative l op (%) green b lue coo l white war m white
8 color bin selection [x 3 ] individual reel will contain parts from one full bin only. option selection details asmt-mxxx C x x 1 x 2 x 3 x 4 x 1 C minimum flux bin selection x 2 C maximum flux bin selection x 3 C color bin selection x 4 C packaging option cool white 0 full distribution a a only b b only c c only d d only e e only f f only g g only h h only l a and g only m b and h only n a and c only p b and d only q e and c only r f and d only s g and h only u e and f only w c and d only z a and b only 1 a, b, c and d only 2 g, h, a and b only 4 c, d, e and f only warm white 0 full distribution a a only b b only c c only d d only e e only f f only n a and c only p b and d only q e and c only r f and d only u e and f only w c and d only z a and b only 1 a, b, c and d only 4 c, d, e and f only other colors 0 full distribution z a and b y b and c w c and d v d and e q a, b and c p b, c and d n c, d and e flux bin limit [x 1 x 2 ] bin luminous flux (lm) at i f = 350ma min. max. d 11.5 15.0 e 15.0 19.5 f 19.5 25.5 g 25.5 33.0 h 33.0 43.0 j 43.0 56.0 k 56.0 73.0 tolerance for each bin limits is 10%
9 cool white color limits (chromaticity coordinates) bin a x y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 bin b x y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.345 bin c x y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 bin d x y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 bin e x y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 bin f x y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 bin g x y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 bin h x y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 tolerance: 0.01 figure 19. color bins (warm white). figure 18. color bins (cool white). 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 x - coo r d inate y - coo r d inate b c e b l ack b o d y c ur v e d a f 4.5 k 5.6 k 7 k 10 k 4.0 k g h 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 x - coo r d inate y - coo r d inate b c e b l ack b o d y c ur v e d a f 3.0 k 3.5 k 4.0 k 2.6 k color bin limits warm white color limits (chromaticity coordinates) bin a x y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 bin b x y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 bin c x y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 bin d x y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 bin e x y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 bin f x y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 tolerance: 0.01 color bin min. max. red full distribution 620.0 635.0 amber a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 blue a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 green a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 tolerance: 1 nm
10 sub-color binning (only applicable for color bin a to bin d and bin g to bin h) cool white (chromaticity coordinates) bin d1 x y 0.329 0.345 0.329 0.331 0.317 0.320 0.316 0.333 bin d2 x y 0.329 0.331 0.329 0.320 0.318 0.310 0.317 0.320 bin d3 x y 0.329 0.320 0.329 0.302 0.320 0.293 0.318 0.310 bin d4 x y 0.316 0.333 0.317 0.320 0.307 0.311 0.305 0.322 bin d5 x y 0.317 0.320 0.318 0.310 0.309 0.300 0.307 0.311 bin d6 x y 0.318 0.310 0.320 0.293 0.311 0.285 0.309 0.300 bin g1 x y 0.392 0.421 0.386 0.400 0.364 0.383 0.367 0.400 bin g2 x y 0.386 0.400 0.382 0.385 0.362 0.372 0.364 0.383 bin h1 x y 0.382 0.385 0.378 0.370 0.360 0.357 0.362 0.372 bin h2 x y 0.378 0.370 0.375 0.358 0.358 0.343 0.360 0.357 bin h3 x y 0.375 0.358 0.371 0.344 0.356 0.330 0.358 0.343 tolerances 0.01 color limits cool white (chromaticity coordinates) bin a1 x y 0.364 0.383 0.367 0.400 0.348 0.385 0.347 0.372 bin a2 x y 0.364 0.383 0.362 0.372 0.346 0.359 0.347 0.372 bin a3 x y 0.329 0.357 0.329 0.369 0.348 0.385 0.347 0.372 bin a4 x y 0.329 0.345 0.329 0.357 0.347 0.372 0.346 0.359 bin b1 x y 0.362 0.372 0.360 0.357 0.344 0.344 0.346 0.359 bin b2 x y 0.360 0.357 0.358 0.343 0.343 0.331 0.344 0.344 bin b3 x y 0.358 0.343 0.356 0.330 0.341 0.314 0.343 0.331 bin b4 x y 0.329 0.331 0.329 0.345 0.346 0.359 0.344 0.344 bin b5 x y 0.329 0.331 0.344 0.344 0.343 0.331 0.329 0.320 bin b6 x y 0.343 0.331 0.341 0.314 0.329 0.302 0.329 0.320 bin c1 x y 0.329 0.369 0.329 0.357 0.315 0.344 0.314 0.355 bin c2 x y 0.329 0.357 0.329 0.345 0.316 0.333 0.315 0.344 bin c3 x y 0.314 0.355 0.315 0.344 0.303 0.333 0.301 0.342 bin c4 x y 0.315 0.344 0.316 0.333 0.305 0.322 0.303 0.333 figure 20. sub-color bins (cool white) 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 x - coo r di na t e y - coo r di na t e 4.5 k 5.6 k 7 k 1 0 k 4.0 k a 1 a2 a3 a4 b1 b 2 b 3 b 4 b 5 b 6 c1 c 2 c 3 c 4 d1 d 2 d 3 d 4 d 5 d 6 g 1 g2 h1 h 2 h 3 black bo d y cur v e
packing tube - option 0 tape & reel - option 1 tape dimension dim value a0 8.800.10 b0 16.450.10 k0 3.600.10 w 24.00.10 p 16.00.10 qty/reel 250ea unit: mm 535.00 1.00 5.45 5.80 4.65 5.50 10.10 37.00 8.30 t op view s i d e view a a b a o b p s e c ti o n b s e c ti o n a k o w f e bo 2.5 figure 21. tube dimensions figure 22. carrier tape dimensions example asmt-mr00-ahj00 asmt-mr00-axxxx C allngap red, non-diused x 1 = h C minimum flux bin h x 2 = j C maximum flux bin j x 3 = 0 C full distribution x 4 = 0 C tube option packaging option [x 4 ] selection option 0 tube 1 tape & reel
reel dimensions r 1 0.00 60.0 o 268.00 330.00 1 .00 99.50 1 .00 2.30 2.30 24.0 +1 .00 ? 0.00 1 3.50 0.50 2.50 0.50 r 1 0.50 0.50 1 20.0 o en d there s hall b e a m ini m u m o f 160 mm o f e mp ty compo nent poc ket s s eale d with co ver ta p e. mo unte d with compo nent s there s hall b e a m ini m u m o f 390 mm o f e mp ty compo nent poc ket s s eale d with co ver ta p e. s tart tape & reel - option 1 (cont.) tape dimension figure 23. carrier tape leader and trailer dimensions figure 24. reel dimensions
disclaimer avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct op- eration of a nuclear facility or for use in medical devices or applications. customer is solely re- sponsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. handling precaution the encapsulation material of the product is made of sili- cone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during as- sembly or handling, the unit should be held on the body only. please refer to avago application note an5288 for detail information. moisture sensitivity this product is qualied as moisture sensitive level 2a for ingan devices and msl 4 for alingap devices per jedec j-std-020. precautions when handling this mois- ture sensitive product is important to ensure the reliabil- ity of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the humidity indicator card (hic) indicates that baking is not required, then it is safe to reow the leds per the original msl rating. it is not recommended to open the mbb prior to assembly (e.g. for iqc). for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. obsoletes av01-0668en av02-0129en - october 5, 2010 b. control after opening the mbb the humidity indicator card (hic) shall be read immediately upon opening of mbb. the leds must be kept at <30c/60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours for msl 2a and 72 hours for msl 4. c. control for unnished reel for any unused leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembly boards if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their oor life of 672 hours for msl 2a and 72 hours for msl 4. e. baking is required if hic 10% indicator is not blue and 5% indicator is pink. - the leds are exposed to condition of >30c/60% rh at any time. the leds oor life exceeded 672 hours for msl 2a and 72 hours for msl 4. recommended baking condition: 605oc for 20hrs.

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